ReviewsDr. Sabnis has provided a broad overview of the major failure mechanisms afflicting modern semiconductor devices, and he has compiled a carefully selected list of references for each subject. He has also summarized many of the methods developed over time to evaluate reliability of these devices. I strongly recommend this book to all those*bMboth neophytes and experts*bMinvolved in the design, fabrication, and application of integrated circuits. --From the Foreword by Carl W. Green, Head, IC Test Technology, AT&T Bell Laboratories
Dewey Edition20
Series Volume NumberVolume 22
Volume NumberVolume 22
IllustratedYes
Dewey Decimal621.39/5 s
Table Of ContentIntroduction. Reliability Concepts and Modeling. Electrostatic Discharge Damage. Metal Electromigration. Dielectric Breakdown. Instabilities in ICs. Packaging Related Reliability Issues. Reliability Assurance and Qualification. Each chapter includes references. Index.
SynopsisMost of the literature on the subject of IC reliability emphasizes the theoretical aspects. This book offers managers and engineers insight into th practical aspects of VLSI reliability, from basic concepts to packaging issu Other topics covered include failure analysis techniques, radiation effect, As integrated cicuits become more complex, with smaller and smaller geometries, much more care must be taken to avoid reliability problems. This practical volume covers a broad spectrum of reliability issues in integrated circuits, from basic concepts to packaging.