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Soldering in Electronics Assembly by Keith Brindley and Mike JUDD (1999, Hardcover)
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About this product
Product Identifiers
PublisherElsevier Science & Technology
ISBN-100750635452
ISBN-139780750635455
eBay Product ID (ePID)594324
Product Key Features
Number of Pages369 Pages
Publication NameSoldering in Electronics Assembly
LanguageEnglish
Publication Year1999
SubjectIndustrial Design / Packaging, Manufacturing, Electronics / General, Electronics / Digital
FeaturesRevised
TypeTextbook
AuthorKeith Brindley, Mike Judd
Subject AreaTechnology & Engineering
FormatHardcover
Dimensions
Item Height1.1 in
Item Weight35.3 Oz
Item Length9.2 in
Item Width6.1 in
Additional Product Features
Edition Number2
Intended AudienceScholarly & Professional
LCCN99-224069
Dewey Edition21
Reviews'This excellent book clearly explains soldering processes, solder, flux, cleaning and quality control, as they apply to printed circuit board assembly. [The book] deserves a place on the desk or bench of everyone involved in the practical business of modern machine soldering in electronics.' ITRI Journal
IllustratedYes
Dewey Decimal621.381531
Edition DescriptionRevised edition
Table Of ContentSoldering process; Electronics assemblies; Solder; Flux; CS soldering processes; SC soldering processes; BGA technology; Cleaning of soldered assemblies; Avoiding problems - soldering quality; Standards and specifications; Glossary; References; Worldwide addresses; Appendices: Why not blame the machine?, Problems and solutions, Soldering safety, Comparing soldering processes and machines
SynopsisManagers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology., Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. A practical guide for the industry covering all the main soldering processes currently in use Cleaning, faults, troubleshooting and standards are all major topics Considers safety and solder process quality assessment
LC Classification NumberTK7816.B74 1999
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