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Quality Conformance and Qualification of Microelectronic Packages and Interconnects by Michael Pecht (1994, Trade Paperback)
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About this product
Product Identifiers
PublisherWiley & Sons, Incorporated, John
ISBN-100471594369
ISBN-139780471594369
eBay Product ID (ePID)1038763
Product Key Features
Number of Pages496 Pages
LanguageEnglish
Publication NameQuality Conformance and Qualification of Microelectronic Packages and Interconnects
Publication Year1994
SubjectIndustrial Design / Packaging, Electronics / General, Quality Control
TypeTextbook
Subject AreaTechnology & Engineering
AuthorMichael Pecht
FormatTrade Paperback
Dimensions
Item Height1.2 in
Item Weight31.3 Oz
Item Length9.3 in
Item Width6.1 in
Additional Product Features
Intended AudienceScholarly & Professional
LCCN93-009709
Dewey Edition20
IllustratedYes
Dewey Decimal621.381046
Table Of ContentThree-Dimensional Stacked Dies. Cofired Ceramic Substrates. Organic Laminated Substrates and Chip-on-Board. High-Density Interconnects and Deposited Dielectrics. Wire and Wirebonds. Tape Automated Bonds. Flip-Chip Bonds. Device and Substrate Attachment. Cases. Leads. Lead Seals. Lid Seals. Material and Product Evaluation Methods. Rework Methods. Bibliography. Index.
SynopsisAll packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted away from the MIL-STDs and other government standards and test procedures that dont cost-effectively address potential failure mechanisms or the manufacturing processes of the product. It has shifted decisively towards tackling the root causes of failure and the appropriate implementation of cost-effective process controls, qualityscreens, and tests. This books groundbreaking, science-based approach to developing qualification and quality assurance programs helps engineers reach a new level of reliability in todays high-performance microelectronics. It does this with powerful... Techniques for identifying and modeling failure mechanisms earlier in the design cycle, breaking the need to rely on field data Physics-of-failure product reliability assessment methods that can be proactively implemented throughout the design and manufacture of the product Process controls that decrease variabilities in the end product and reduce end-of-line screening and testing A wide range of microelectronic package and interconnect configurations for both single-and multi-chip modules is examined, including chip and wire-bonds, tape-automated (TAB), flip-TAB, flip-chip bonds, high-density interconnects, chip-on-board designs (COB), MCM, 3-D stack, and many more. The remaining package elements, such as die attachment, case and lid, leads, and lid and lead seals are also discussed in detail. The product of a distinguished team of authors and editors, this books guidelines for avoiding potential high-risk manufacturing and qualification problems, as well as for implementing ongoing quality assurance, are sure to prove invaluable to both students and practicing professionals. For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGN GUIDELINES: A Focus on Reliability Michael Pecht This comprehensive guide features a uniquely organized time-phased approach to design, development, qualification, manufacture, and in-service management. It provides step-by-step instructions on how to define realistic system requirements, define the system usage environment, identify potential failure modes, characterize materials and processes by the key control label factors, and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins. Topics covered include: detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions. 1993 (0-471-59446-6) 454 pp., All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp., All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted., All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls, qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined, including chip and wire-bonds, tape-automated (TAB), flip-TAB, flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions, materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
LC Classification NumberTK7870.15.Q35 1994
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