Design and Modeling for 3D ICS and Interposers by Madhavan Swaminathan (2013, Hardcover)

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About this product

Product Identifiers

PublisherWorld Industries Scientific Publishing Co Pte LTD
ISBN-109814508594
ISBN-139789814508599
eBay Product ID (ePID)177901251

Product Key Features

Publication Year2013
TopicIndustrial Design / Packaging, Electronics / Semiconductors, Electronics / Circuits / Integrated, Electronics / General
Book TitleDesign and Modeling for 3d Ics and Interposers
Number of Pages380 Pages
LanguageEnglish
IllustratorYes
GenreTechnology & Engineering
AuthorMadhavan Swaminathan
FormatHardcover

Dimensions

Item Weight0 Oz

Additional Product Features

Dewey Edition23
Dewey Decimal621.3815
Synopsis3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. the authors underscored the potential of this technology in design exchange formats and power distribution.
LC Classification NumberTK7874.893
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