Book TitleDesign and Modeling for 3d Ics and Interposers
Number of Pages380 Pages
LanguageEnglish
IllustratorYes
GenreTechnology & Engineering
AuthorMadhavan Swaminathan
FormatHardcover
Dimensions
Item Weight0 Oz
Additional Product Features
Dewey Edition23
Dewey Decimal621.3815
Synopsis3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. the authors underscored the potential of this technology in design exchange formats and power distribution.