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Electronic Failure Analysis Handbook - Hardcover, by Martin Perry L.
US $29.99
ApproximatelyRM 126.72
Condition:
Good
A book that has been read but is in good condition. Very minimal damage to the cover including scuff marks, but no holes or tears. The dust jacket for hard covers may not be included. Binding has minimal wear. The majority of pages are undamaged with minimal creasing or tearing, minimal pencil underlining of text, no highlighting of text, no writing in margins. No missing pages.
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Shipping:
US $8.97 (approx RM 37.90) USPS Media MailTM.
Located in: Patterson, New York, United States
Delivery:
Estimated between Fri, 5 Sep and Wed, 10 Sep to 94104
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No returns accepted.
Coverage:
Read item description or contact seller for details. See all detailsSee all details on coverage
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eBay item number:396989893488
Item specifics
- Condition
- Book Title
- Electronic Failure Analysis Handbook
- ISBN
- 9780070410442
About this product
Product Identifiers
Publisher
McGraw-Hill Professional Publishing
ISBN-10
0070410445
ISBN-13
9780070410442
eBay Product ID (ePID)
889641
Product Key Features
Number of Pages
520 Pages
Publication Name
Electronic Failure Analysis Handbook
Language
English
Publication Year
1999
Subject
Electrical, Electronics / General
Type
Textbook
Subject Area
Technology & Engineering
Format
Hardcover
Dimensions
Item Height
2.1 in
Item Weight
49.9 Oz
Item Length
9.5 in
Item Width
7.6 in
Additional Product Features
Intended Audience
College Audience
LCCN
95-021328
Dewey Edition
21
Illustrated
Yes
Dewey Decimal
621.3/81
Table Of Content
Part I: Introduction to Electronic Failure Analysis. Overview of Electronic Component Reliability. Overview of Electronic Systems Reliability. Product Liability. Part II: Electronic Failure Analysis Techniques. Photography and Optical Microscopy. X-Ray/Radiographic Component Inspection. Infrared Thermography. Acoustic Micro Imaging Failure Analysis of Electronic Devices. Metallography. Chemical Characterization. Electronic and Electrical Characterization. Scanning Electron Microscopy and X-Ray Analysis. Miscellaneous Techniques. Part III: Electronic Failure Analysis for Specific Technologies. Solder Joints. Failure Analysis of Printed Wiring Assemblies. Wires and Cables. Switches and Relays. Connection Technology. Failure Analysis of Components. Semiconductors. Power and High-Voltage Considerations.
Synopsis
For electronic parts suppliers, systems designers, and fabricators--to help protect against product and system failure: Features: components ranging from microelectronics to wires and cables; a wealth of case studies; extremely comprehensive coverage of the entire industry.
LC Classification Number
TK7870.23.M37 1999
Item description from the seller
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