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Interconnects in VLSI Design by Hartmut Grabinski: New

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Item specifics

Condition
Brand New: A new, unread, unused book in perfect condition with no missing or damaged pages. See all condition definitionsopens in a new window or tab
Book Title
Interconnects in VLSI Design
Publication Date
2000-10-31
Pages
236
ISBN
9780792379973

About this product

Product Identifiers

Publisher
Springer
ISBN-10
0792379977
ISBN-13
9780792379973
eBay Product ID (ePID)
1913835

Product Key Features

Number of Pages
VII, 236 Pages
Language
English
Publication Name
Interconnects in Vlsi Design
Subject
Electronics / Semiconductors, Electronics / Circuits / Vlsi & Ulsi, Cad-Cam, Electronics / Circuits / General, Electrical
Publication Year
2000
Type
Textbook
Subject Area
Computers, Technology & Engineering
Author
Hartmut Grabinski
Format
Hardcover

Dimensions

Item Weight
40.9 Oz
Item Length
9.6 in
Item Width
6.7 in

Additional Product Features

Intended Audience
Scholarly & Professional
LCCN
00-046973
Dewey Edition
21
Number of Volumes
1 vol.
Illustrated
Yes
Dewey Decimal
621.39/5
Table Of Content
Recent Development in Interconnect Modeling.- Study of Parallel Plane Mode Excitation at a Double-Layer Via Interconnect Using the FDTD Method.- A Testchip for Analysis of Signal Integrity and Ground-Bounce Effects in Deep-Submicron Technology.- Measurement of Signal Integrity within Deep-Submicron Interconnect.- Considering Magnetic Interference in Board-Level Interconnect Design.- Input Shape Influence over Interconnect Performances.- Comparison of RL and RLC Interconnect Models in the Simultaneous Switching Noise Simulations.- Black-Box Modeling of Digital Devices>.- Advanced Modeling of Nonuniform Interconnects.- Modeling of Passive Components for Radio Frequency Applications.- Electrical Performance of Capacitors Integrated in Multi-Layered Printed Circuit Boards.- Characteristic Impedance Measurement on Silicon.- Efficient Computation of the Parameters of Parallel Transmission Lines in IC Interconnects.- Modeling of Optical Interconnections for Data Transmission within High-Speed Electronic Systems.- Quantifying the Impact of Optical Interconnect Latency on the Performance of Optoelectronic FPGA's.- PIN CMOS Receivers for Optical Interconnects.- BICMOS Receiver OEIC for Optical Interconnect.- Electrical/Optical Circuit Boards: Technology - Design - Modeling.
Synopsis
This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua­ tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des­ cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects., This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua- tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des- cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
LC Classification Number
TK7867-7867.5

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