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This listing was ended by the seller on Fri, 26 Apr at 8:13 AM because the item is no longer available.
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Low-Melt Lead-free Solder Paste 50g Reballing Stencil for IPhone 6 Chip Repair

Condition:
New
Ended: Apr 27, 2024 08:13:33 MYT
3 available
Price:
US $19.79
ApproximatelyRM 94.45
Was US $21.99 What does this price mean?
Recent sales price provided by the seller
Save US $2.20 (10% off)
Postage:
Free Standard Shipping from outside US. See detailsfor shipping
Located in: HK, Hong Kong
Delivery:
Estimated between Fri, 10 May and Wed, 29 May to 43230
Estimated delivery dates - opens in a new window or tab include seller's handling time, origin ZIP Code, destination ZIP Code and time of acceptance and will depend on shipping service selected and receipt of cleared paymentcleared payment - opens in a new window or tab. Delivery times may vary, especially during peak periods.
Returns:
30 days return. Buyer pays for return shipping. See details- for more information about returns
Coverage:
Read item description or contact seller for details. See all detailsSee all details on coverage
(Not eligible for eBay purchase protection programmes)

Seller information

Registered as a Business Seller
Seller assumes all responsibility for this listing.
eBay item number:355495551542

Item specifics

Condition
New: A brand-new, unused, unopened, undamaged item in its original packaging (where packaging is ...
Brand
Generic
MPN
10145410112100600
Model
BGA Heated Directly Stencil+50g Lead-free Solder Paste

Item description from the seller