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Fundamentals of Microsystems Packaging by Tummala Rao Hardcover 2001

US $40.49
ApproximatelyRM 170.54
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Was US $44.99 (10% off)What does this price mean?
Recent sales price provided by the seller
Condition:
Good
Some bends on the spine edges and outer corners and a mark across the bottom page edges. Still ... Read moreabout condition
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eBay item number:267352078216

Item specifics

Condition
Good
A book that has been read but is in good condition. Very minimal damage to the cover including scuff marks, but no holes or tears. The dust jacket for hard covers may not be included. Binding has minimal wear. The majority of pages are undamaged with minimal creasing or tearing, minimal pencil underlining of text, no highlighting of text, no writing in margins. No missing pages. See all condition definitionsopens in a new window or tab
Seller Notes
“Some bends on the spine edges and outer corners and a mark across the bottom page edges. Still ...
Publication Year
2001
Type
Hardcover
Format
Hardcover
Language
English
Publication Name
Fundamentals of Microsystems Packaging
Author
Tummala Rao
Subject
Engineering (General)

Item description from the seller

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DirtDawgProductions

100% positive feedback3.6K items sold

Joined Oct 2001
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Thanks for visiting! I've been selling on ebay part time for over 20 years, time flies. My dog Toby thanks you too - he loves the treats he gets from our little side hustle :)

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