Back to eBay Home
|Listed in category:

Picture 1 of 5

Fundamentals of Microsystems Packaging by Tummala Rao Hardcover 2001 - Picture 1 of 5
Fundamentals of Microsystems Packaging by Tummala Rao Hardcover 2001 - Picture 2 of 5
Fundamentals of Microsystems Packaging by Tummala Rao Hardcover 2001 - Picture 3 of 5
Fundamentals of Microsystems Packaging by Tummala Rao Hardcover 2001 - Picture 4 of 5
Fundamentals of Microsystems Packaging by Tummala Rao Hardcover 2001 - Picture 5 of 5
Have one to sell?
Sell it yourself

Fundamentals of Microsystems Packaging by Tummala Rao Hardcover 2001

DirtDawgProductions
(1590)
Seller's other items
Contact seller
US $44.99
ApproximatelyRM 190.98
or Best Offer
Condition:
Good
“Some bends on the spine edges and outer corners and a mark across the bottom page edges. Still ”... Read moreabout condition
Pickup:
Free local pickup from Tempe, Arizona, United States.
Shipping:
US $13.24 (approx RM 56.20) UPS Ground.
Located in: Tempe, Arizona, United States
Delivery:
Estimated between Tue, 12 Aug and Thu, 14 Aug to 94104
Estimated delivery dates - opens in a new window or tab include seller's handling time, origin ZIP Code, destination ZIP Code and time of acceptance and will depend on shipping service selected and receipt of cleared paymentcleared payment - opens in a new window or tab. Delivery times may vary, especially during peak periods.
Returns:
No returns accepted.
Coverage:
Read item description or contact seller for details. See all detailsSee all details on coverage
(Not eligible for eBay purchase protection programmes)
Seller assumes all responsibility for this listing.
eBay item number:267352078216

Item specifics

Condition
Good
A book that has been read but is in good condition. Very minimal damage to the cover including scuff marks, but no holes or tears. The dust jacket for hard covers may not be included. Binding has minimal wear. The majority of pages are undamaged with minimal creasing or tearing, minimal pencil underlining of text, no highlighting of text, no writing in margins. No missing pages. See all condition definitionsopens in a new window or tab
Seller Notes
“Some bends on the spine edges and outer corners and a mark across the bottom page edges. Still ...
Publication Year
2001
Type
Hardcover
Format
Hardcover
Language
English
Publication Name
Fundamentals of Microsystems Packaging
Author
Tummala Rao
Subject
Engineering (General)

Item description from the seller

About this seller

DirtDawgProductions

100% positive feedback•3.6K items sold

Joined Oct 2001
Usually responds within 24 hours
Thanks for visiting! I've been selling on ebay part time for over 20 years, time flies. My dog Toby thanks you too - he loves the treats he gets from our little side hustle :)
Visit storeContact

Detailed Seller Ratings

Average for the last 12 months
Accurate description
5.0
Reasonable shipping cost
4.9
Shipping speed
5.0
Communication
5.0

Seller feedback (1,578)

All ratings
Positive
Neutral
Negative
See all feedback

More to explore :