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Teradek Bond 759 HEVC Backpack w/ 4 x Node I Modules, (V-Mount)
US $999.00
ApproximatelyRM 4,289.71
or Best Offer
Condition:
“w/ 4x Node II Modules Read AD”
Used
An item that has been used previously. The item may have some signs of cosmetic wear, but is fully operational and functions as intended. This item may be a floor model or store return that has been used. See the seller’s listing for full details and description of any imperfections.
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Shipping:
US $35.87 (approx RM 154.03) FedEx Ground or FedEx Home Delivery®.
Located in: Chester, New Jersey, United States
Delivery:
Estimated between Tue, 20 May and Thu, 22 May to 43230
Returns:
No returns accepted.
Coverage:
Read item description or contact seller for details. See all detailsSee all details on coverage
(Not eligible for eBay purchase protection programmes)
Shop with confidence
Seller assumes all responsibility for this listing.
eBay item number:175847683571
Item specifics
- Condition
- Used
- Seller Notes
- “w/ 4x Node II Modules Read AD”
- Brand
- Teradek
- Type
- Accessory
- Model
- Teradek Bond 759
- MPN
- Bond 759 HEVC
- UPC
- Does not apply
Item description from the seller
Seller feedback (11,931)
- .***c (132)- Feedback left by buyer.Past monthVerified purchasegood
- c***c (513)- Feedback left by buyer.Past monthVerified purchaseFast shipping
- c***c (513)- Feedback left by buyer.Past monthVerified purchaseFast shipping!
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